Christer Hedlund

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Background

I´ve a PhD in electronics from Uppsala University. My work experience comes from a wide range of different organizations including academia, two global electronics manufacturer, high-tech start-ups and small local manufacturing industry. Since 2008 I have been running my own consultant business where I part-time coach and educate Lean to organizations.
Since 2013 I am affiliated as a senior lecturer with Mid Sweden University.

Master of Science in engineering Physics Uppsala University 1991. Ph.D. in electronics Uppsala University 1997
Post-doc at University of New York, Albany, 1999.
Researcher, Research leader Uppsala University, 2000.
Research and development of plastic memory technology,Thin Film Electronics, 2000-2005.
Process owner and Lean leader, PCBA manufactuing Solectron/Flextronics, 2006-2009.
Consultant in my own business. Quality development/Lean, 2009-now.
CEO manufacturing company in forrest technology sector, 2010.
Lean coach in Swedish national programme Produktionslyftet, 2010-now.
Started, developed and sold one manufacturing company, 2011-2012.
Assistant professor Quality technology, part time from 2013 and full time from 2016.

Area of interest

My research interest on how team and organizations can organize work to create a learning environment. My focus is on behaviors, values and leadership, usually within the context of the quality initiative Lean.

Quality Technology, Quality Management, Quality Development, Change Management, Lean, Continuous Improvements.

Previous research areas: Solid State Electronics, Plasma Processing, Micromechanics, Dry Etching, Thin Film Processes.

Current research

Since 2015 I´m a part of the research project "Simply Lean" a project funded by the Knowledge Foundation to explore how quality can be enhanced in Swedish businesses by developing an internal coaching model to support value-based leadership. A leadership that integrates values, organizational culture, customer needs and sustainable development. The three-year project is a research and development partnership between three Swedish manufacturing companies and Mid Sweden University.

Teaching and tutoring

Teaches at our Master's program "Quality Management and Leadership" where I also supervise Master theses. Teaches Lean introductory courses.

I have an interest in cooperation and commissioned education., and are currently involved in an assignment with Åre municipality where we educate both management, leaders and coaches in Lean and quality development.

Other information

Mobile Phone +46 708-829 321
Room Q109C

Publications

Articles in journals

Köhler, J. , Strandman, C. , Vallin, Ö. , Hedlund, C. & Bäcklund, Y. (2001). Silicon fusion bond interfaces resilient to wet anisotropic etchants. Journal of Micromechanics and Microengineering, vol. 11, pp. 359-363.  

Rosén, D. , Olsson, J. & Hedlund, C. (2001). Membrane Covered Electrically Isolated Through-Wafer Via Holes. Journal of Micromechanics and Microengineering, vol. 11: 4, pp. 344-347.  

Jonsson, K. , Köhler, J. , Hedlund, C. & Stenmark, L. (2001). Oxygen Plasma Wafer Bonding Evaluated by the Weibull Fracture Probability Method. Journal of Micromechanics and Microengineering, vol. 11: 4, pp. 364-370.  

Pasquariello, D. , Hedlund, C. & Hjort, K. (2000). Oxidation and induced damages in oxygen plasma in situ wafer bonding. Journal of the Electrochemical Society, vol. 147: 7, pp. 2699-2703.  

Jonsson, L. , Westlinder, J. , Engelmark, F. , Hedlund, C. , Du, J. , Smith, U. & Blom, H. (2000). Patterning of tantalum pentoxide, a high epsilon material, by inductively coupled plasma etching. Journal of Vacuum Science and Technology B, vol. 18: 4, pp. 1906-1910.  

Pasquariello, D. , Lindeberg, M. , Hedlund, C. & Hjort, K. (2000). Surface energy as a function of self-bias voltage in oxygen plasma wafer bonding. Sensors and Actuators A-Physical, vol. A82, pp. 239-244.  

Thornell, G. , Ericson, F. , Hedlund, C. , Ohrmalm, J. , Schweitz, J. & Portnoff, G. (1999). Residual stress in sputtered gold films on quartz measured by the cantilever beam deflection technique. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, vol. 46: 4, pp. 981-992.

Jonsson, L. , Hedlund, C. , Katardjiev, I. & Berg, S. (1999). Compositional variations of sputter deposited Ti/W barrier layers on substrates with pronounced surface topography. Thin Solid Films, vol. 348: 1-2, pp. 227-232.  

Schaepkens, M. , Oehrlein, G. S. , Hedlund, C. , Jonsson, L. & Blom, H. (1998). Selective SiO2-to-Si3N4 etching in inductively coupled fluorocarbon plasmas: Angular dependence of SiO2 and Si3N4 etching rates. Journal of Vacuum Science & Technology. A. Vacuum, Surfaces, and Films, vol. A16: 6, pp. 3281  

Rangsten, P. , Hedlund, C. , Katardjiev, I. & Backlund, Y. (1998). Etch rates of crystallographic planes in Z-cut quartz - experiments and simulation. Journal of Micromechanics and Microengineering, vol. 8: 1, pp. 1-6.  

Shamrai, K. P. , Virko, V. F. , Blom, H. , Pavlenko, V. P. , Taranov, V. B. , Jonsson, L. , Hedlund, C. & Berg, S. (1997). Discharge disruptions in a helicon plasma source. Journal of Vacuum Science & Technology. A. Vacuum, Surfaces, and Films, vol. 15: 6, pp. 2864-2874.  

Hedlund, C. , Jonsson, L. , Katardjiev, I. , Berg, S. & Blom, H. (1997). Angular dependence of the polysilicon etch rate during dry etching in SF6 and Cl-2. Journal of Vacuum Science & Technology. A. Vacuum, Surfaces, and Films, vol. 15: 3, pp. 686-691.  

Hedlund, C. , Strandman, C. , Katardjiev, I. , Bäcklund, Y. , Berg, S. & Blom, H. (1996). A Method for the Determination of the Angular Dependence during Dry Etching. Journal of Vacuum Science & Technology B, vol. 14: 5, pp. 3239  

Jonsson, L. , Hedlund, C. , Katardjiev, I. , Barklund, A. , Blom, H. & Berg, S. (1995). Controlled topography production - True 3D simulation and experiment. Vacuum, vol. 46, pp. 971-975.  

Conference papers

Bäckström, I. , Ingelsson, P. , Snyder, K. , Hedlund, C. & Lilja, J. (2016). Collection of baseline data – expanding the scope. In EurOMA 2016 - Interactions.

Snyder, K. , Hedlund, C. , Ingelsson, P. & Bäckström, I. (2016). Storytelling as a co-creative process to build cultures of quality, innovation and sustainability. Paper presented at the 19th QMOD conference; International Conference on Quality and Service Sciences (ICQSS 2016), 21-23 September 2016, Rome

Hedlund, C. , Lilja, J. , Ingelsson, P. , Bäckström, I. & Snyder, K. (2016). Research On Toyota Kata? Proposing A Future Research Agenda For The Emerging Practice. In EurOMA Conference Proceedings : Interactions 2016.

Ingelsson, P. , Bäckström, I. , Snyder, K. , Hedlund, C. & Lilja, J. (2016). Using the employee satisfaction survey as a tool for building organizational culture. In EurOMA Conference Proceedings : Interactions, 2016.

Köhler, J. , Simu, U. , Bejhed, J. , Kratz, H. , Jonsson, K. , Nguyen, H. , Bruhn, F. , Hedlund, C. & et al. (2001). A hybrid cold gas microthruster system for spacecraft. In Digest of Papers for the 11th Int Conf on Solid-State Sensors and Actuators - Transducers '01 and Eurosensors XV, Munich, Germany, June 10-14.. pp. 886--889.

Vallin, Ö. , Einefors, B. , Hedlund, C. & Thornell, G. (2001). Direct bonded quartz resonators. In Proc. of the IEEE International Frequency Control Symposium, Seattle, USA, June 6-8.

Köhler, J. , Strandman, C. , Vallin, Ö. , Hedlund, C. & Bäcklund, Y. (2000). Silicon fusion bond interfaces resilient to wet anisotropic etchants. In Micromechanics Europe 2000, Uppsala.. pp. 142--145.

Rosén, D. , Olsson, J. & Hedlund, C. (2000). Membrane covered electrically isolated through-wafer via hole. In Workshop Digest MME'00, Uppsala, Sweden.. pp. B4-

Jonsson, K. , Köhler, J. , Hedlund, C. & Stenmark, L. (2000). Oxygen plasma wafer bonding evaluated by the weibull fracture probability method. In Proc of the Eleventh Micromechanics Europe Workshop, Oct, Uppsala, Sweden.

Hagman, B. , Richard, Å. , Bäcklund, Y. & Hedlund, C. (2000). Anodic bonding of materials with large difference in thermal expansion. In MME'00 (Micro Mechanics Europe), October 1-3, Uppsala, Sweden.

Pasquariello, D. , Hedlund, C. & Hjort, K. (1999). Damages in oxygen plasma bonding. In The 5th Int Symp Semicind Wafer Bond, 196th Electrochem Soc Meeting, Honolulu, Hawaii Abstract no 1001.

Westlinder, J. , Engelmark, F. , Jonsson, L. , Hedlund, C. , Katardjiev, I. & Blom, H. (1999). Analysis and Simulation of Mask Erosion During Etching. In American Vacuum Society 46th National Symposium, Seattle, USA.

Pasquariello, D. , Karlsson, M. , Greek, S. , Hedlund, C. , Gupta, R. & Hjort, K. (1998). InP based Micro Opto Electro Mechanics. Paper presented at the 3rd Micro Structure Workshop, March 24-25, 1998, Uppsala, Sweden

Schaepkens, M. , Standaert, T. E. F. M. , Reuger, N. R. , Oehrlein, G. S. , Hedlund, C. , Blom, H. & Cook, J. M. (1998). Selective SiOs to Si3N4 etching in inductively coupled fluorocarbon plasmas. In The 25th national symposium UNY-VAC, Albany NY.

Bäcklund, Y. , Vangbo, M. , Rangsten, P. & Hedlund, C. (1998). Wet etching of single crystal quartz. In Workshop of Physical Chemistry of Wet Chemical Etching of Silicon, May 17-19, Holten, The Netherlands.

Jonsson, L. , Engelmark, F. , Du, J. , Hedlund, C. , Smith, U. & Blom, H. (1998). Patterning of Reactively Sputteres Tantalum Pentoxide, a High Epsilon Material, by Plasma Etching. In The American Vacuum Society 45th National Symposium in Baltimore.

Köhler, J. , Vallin, Ö. , Strandman, C. , Hedlund, C. & Bäcklund, Y. (1997). Etching through Si-Si direct bonded interfaces. In MME´97.

Jonsson, L. , Hedlund, C. , Larsson, T. , Katardjiev, I. , Berg, S. & Blom, H. (1997). Characterization and optimization of a dry etching process for silicon nitride spacer formation. In The 44th international symposium of the American Vacuum Society, San José, USA.

Rangsten, P. , Hedlund, C. , Katardjiev, I. & Bäcklund, Y. (1996). An experimental study and simulation of anisotropic wet etching of quartz. In MME´96, Oct 21-22, Barcelona, Spain.

Hedlund, C. , Strandman, C. , Katardjiev, I. , Bäcklund, Y. , Berg, S. & Blom, H. (1995). A method for the determination of the angular dependence during dry etching. In The American Vacuum Society, 42nd National Symposium, Minneapolis, USA, Oct.